Demand description
1. Determine whether to fit the BMU tape according to the photoelectric signal of the assembly line;
2. After receiving the PLC signal, it is sent to the YMAHA manipulator positioning coordinates through the CCD;
3. Perform BMU tape bonding;
program process
1. First complete the communication between the YMAHA manipulator and the PLC to transmit data;
2. First receive the PLC camera signal, then locate the BMU tape and send the offset to the manipulator for bonding;
Project picture